Dust-Resistant Non-Contact Interconnect. EBO Expanded Beam Optical Connector.
An advanced multi-core fiber system based on lens-array expanded beam technology. By transmitting optical signals without physical contact, it eliminates wear, dramatically reduces sensitivity to dust contamination, and delivers hassle-free, genderless mating for high-density optical backplanes and networks.
Non-Contact Transmission
Dust & Vibration Resistant
Genderless Design
Hot-Swappable
Main Features
Dust & Vibration Immunity
Utilizes molded lens arrays to expand light beams across mating interfaces. Non-contact optical coupling drastically lowers sensitivity to dust, debris, and vibration, reducing the need for frequent cleaning and maintenance.
Simplified Inventory & Mating
Features a pinless, genderless connector architecture that eliminates traditional metal guide pins. Simplifies stock management, streamlines installation, and works seamlessly with SENKO EBO Dual-key adapters to prevent mis-mating.
Low-Force Push-Pull Latching
Incorporates a standard MPO-style push-pull locking mechanism and push-pull boot for easy connection in tight panel spaces. Supports live hot-swapping to ensure zero network downtime during maintenance.
High-Count Core Scalability
Fully supports both Single-Mode (SM) and Multi-Mode (MM) applications across 12, 16, and up to 144-core configurations, achieving low insertion loss and high return loss across diverse network topologies.
Technical Specifications
| Parameter | Specification Details |
|---|---|
| Fiber Core Count | 12, 16, 144 Cores |
| Fiber Type | Single-Mode (SM) / Multi-Mode (MM) |
| Connector Color | Green (SM), Aqua (OM3), Magenta (OM4) |
| Boot Color | Black |
| Adapter Compatibility | Compatible with SENKO EBO Dual-key adapters |
| Latching Mechanism | MPO-style push-pull structure, pinless design |
| Parameter | Single-Mode (SM) | Multi-Mode (MM) |
|---|---|---|
| Operating Wavelength | 1310 nm | 850 nm |
| Insertion Loss | ≤0.7 dB | ≤0.5 dB |
| Return Loss | ≥55 dB | ≥35 dB |
| Operating Temperature | -10°C to +60°C | -10°C to +60°C |
Deployment Scenarios
Hyperscale Data Centers & AI
Ideal for 400G/800G Ethernet, AI compute clusters, and supercomputing environments requiring reliable, high-bandwidth optical interconnects with zero tolerance for signal degradation due to dust.
Optical Backplanes & Test Systems
Versatile physical layer support for multi-core trunk cables, breakout assemblies, optical backplanes, and high-density test equipment where rapid, pinless connection cycles are required.
Eliminate Cleaning Downtime.
Ready to upgrade your high-density optical links with non-contact EBO connector technology? Contact our optics engineering team today to configure your custom core counts and jumper assemblies.