Scaling Ultra-High Density. High-Density Fiber Array Unit.

The core optical engine engineered for CPO harnesses, SiPh integration, and advanced LiDAR systems. Supporting up to 128 channels with sub-micron pitch accuracy (±0.5 µm) and ultra-low insertion loss.

Up to 128 Channels

±0.5 µm Pitch Accuracy

≤0.08 dB Array IL

CPO & SiPh Ready

02

Main Features

01 Extreme Channel Scalability

Massively Parallel Density

Supporting up to 128 channels within a compact array footprint. Tailored for next-generation parallel optical engines, it dramatically reduces physical space requirements while maximizing fiber interconnect throughput.

02 Sub-Micron Precision Process

±0.5 µm Precision Alignment

Manufactured using advanced blade-saw machining and precision substrate etching on Pyrex glass or quartz materials. Achieves tight core pitch tolerances down to ±0.5 µm for flawless, high-efficiency coupling.

03 Exceptional Fiber Versatility

SM & PM Multi-Fiber Compatibility

Seamlessly integrates standard Single-Mode (SM) fibers, Polarization-Maintaining (PM) fibers, or RC&RC PM fibers. Customizable polishing angles, pitch dimensions, and overall unit footprint adapt to any complex layout.

04 Telcordia-Grade Reliability

Industrial-Grade Stability

Fully compliant with RoHS standards and engineered strictly against GR-1209 and GR-1221 reliability metrics. Ensures long-term optical performance and structural integrity under demanding operating conditions.

03

Flexible MT Termination Configurations

Series Channels Max Insertion Loss Min Return Loss Polish Optimal Application
Standard Loss MT 12, 16, 32 ≤0.7 dB ≥55 dB 8° APC Standard transceiver assembly and high-density optical routing.
Low Loss MT 12, 16, 32 ≤0.35 dB ≥55 dB 8° APC Ultra-strict power budget environments in CPO and AI clusters.
04

Technical Specifications

Parameter 1~32CH 32~64CH 64~128CH
Base Material Fiber + MT (Excludes VG and cover plate) Fiber + MT (Excludes VG and cover plate) Fiber + MT (Excludes VG and cover plate)
Fiber Types Corning (or equiv.) SM, PM, RC&RC PM Corning (or equiv.) SM, PM, RC&RC PM Corning (or equiv.) SM, PM, RC&RC PM
Cladding Diameter 125 µm / 80 µm 125 µm / 80 µm 125 µm / 80 µm
Core Pitch Options 127, 250, 82, 84 µm 127, 250, 82, 84 µm 127, 250, 82, 84 µm
Pitch Tolerance ±0.5 µm ±0.7 µm ±1.0 µm
Array Insertion Loss ≤0.08 dB ≤0.08 dB ≤0.08 dB
Array Return Loss ≥14 dB (0°) / ≥55 dB (8°) ≥14 dB (0°) / ≥55 dB (8°) ≥14 dB (0°) / ≥55 dB (8°)
Operating Temp. -40°C to +85°C -40°C to +85°C -40°C to +85°C
Storage Temp. -40°C to +85°C -40°C to +85°C -40°C to +85°C
05

Deployment Scenarios

01 Co-Packaged Optics & Silicon Photonics

CPO Harnesses & SiPh Assembly

Ideal for high-density CPO optical harnesses and Silicon Photonics (SiPh) package integration in data center optical transceivers. Delivers low-loss, high-channel-count optical interface coupling directly to photonic engines.

02 Telecom & Sensing Ecosystems

PLC, AWG & LiDAR Deployment

Powers FTTH PLC splitters, WDM PON AWG modules, and automotive/industrial LiDAR sensor integration. Provides robust, temperature-stable micro-optics alignment across diverse telecom and sensing architectures.

06

Standards & Quality Assurance

RoHS Compliant GR-1209 Reference GR-1221 Reference

Scale Your High-Density Optical Interconnects.

Looking for custom Pyrex/Quartz V-grooves, custom pitch dimensions, or specific PM fiber configurations? Contact our engineering team to customize your 128-channel array solution today.